BAKU BA-5052 BGA Solder Paste for Mobile Phone Repair 35g Tin 35-45 Microns, 138 Celsius Melting Point Africa Design Notebook Finished in stainless steel

Name: BAKU BA-5052 BGA Solder Paste for Mobile Phone Repair 35g Tin 35-45 Microns, 138 Celsius Melting Point Africa Design Notebook Finished in stainless steel
Brand: runnershauling.com
SKU: 27706246560
Price: 16.73 USD
Availability: InStock
Rating: 4.891 (30 reviews)

SKU: 27706246560

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USD16.73 USD55.73

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Finished in stainless steel

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BAKU BA-5052 BGA Solder Paste for Mobile Phone Repair 35g Tin 35-45 Microns, 138 Celsius Melting Point Africa Design Notebook Finished in stainless steel1. Lead free Solder Paste is a high performance, no clean soldering solution designed for precision electronics assembly and repair. Ideal for BGA applications, it delivers exceptional conductivity, reliability, and efficiency while minimizing post weld residue. 2. Strong Adhesion & Extensibility: Provides robust attachment to solder joints and retains flexibility after cooling, ensuring long term durability. 3. Advanced Membrane Removal Technology:

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