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Single stencil for Direct BGA eMMC / eMCP (221 153 169 254 162 186 ) for reballing BGA memory eMMC / EMCP chips found in phones and tablets
It's not quite instant
and they are easy to keep clean from stray solder paste
etc actually plugged into the connector
iSocket iPhone 11/11Pro/11ProMax split board test jig diagnostics Single stencil for Direct BGAThis is an essential tool for iPhone 11 series logic board work. After splitting the logic board, a top mainboard can be attached to a known good bottom board in this iSocket, and vice versa to allow for troubleshooting. The iSocket jig will create temporary connections between the two half boards without having to resolder the boards for testing.
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